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Inverted InAlAs/InGaAs MOSHEMT with Nanoscale Gate Length for Terahertz Applications

S. Kirubashree, Dr. S. Baskaran

Abstract


A 650nm gate-length device exhibited a high drive current at low Vds, with an ultra-low on-resistance. A high peak effective mobility is also going to extracted, indicating excellent electron transport properties. Selectively regrown n++ In0.53Ga0.47As source/drain by MOCVD was incorporated in inverted-type InAlAs/InGaAs MOSHEMTs on GaAs substrates.  The thermal stability of the inverted epitaxial HEMT structure after source/drain regrowth was investigated using Van der Pauw Hall measurements.


Keywords


Inversion Channel InAlAs/InGaAs MOSHEMT, Selective Growth, On-Current, Effective Mobility, Low On-Resistance, High Current.

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References


P. Chang, H.-C. Chiu, T.-D. Lin, M.-L. Huang, W.-H. Chang, S.-Y. Wu, K.-H. Wu, M. Hong, and J. Kwo, “Self-Aligned Inversion-Channel In0.53Ga0.47As Metal–Oxide–Semiconductor Field-Effect Transistors with In-situ Deposited Al2O3/Y2O3 as Gate Dielectrics”, Appl. Phys. Express. vol.4, pp.114202, 2011

R. Terao, T. Kanazawa, S. Ikeda, Y. Yonai, A. Kato, and Y.Miyamoto, “InP/InGaAs Composite Metal–Oxide–Semiconductor Field-Effect Transistors with Regrown Source and Al2O3 Gate Dielectric Exhibiting Maximum Drain Current Exceeding 1.3mA/μm”, Appl. Phys. Express, vol.4, pp. 054201, 2011

Carter, J. J. M. Law, E. Lobisser, G. J. Burek, W. J. Mitchell, B. J. Thibeault, A. C. Gossard, and M. J. W. Rodwell, “60 nm gate length Al2O3 / In0.53Ga0.47As gate-first MOSFETs using InAs raised source-drain regrowth”, 69th IEEE Device Research Conference, pp.19-20, June, 2011

M. Egard, L.Ohlsson, B. M Borg, F.Lenrick, R. Wallenberg, L.-E. Wernersson, and E. Lind, “High transconductance self-aligned gate-last surface channel In0.53Ga0.47As MOSFET”, IEDM Tech. Dig., pp.303-306, Dec. 2011

Y. Yonai, T. Kanazawa, D. Ikeda, and Y. Miyamoto, “High drain current (>2A/mm) InGaAs channel MOSFET at VD=0.5V with shrinkage of channel length by InP anisotropic etching”, IEDM Tech. Dig., pp.307-310, Dec. 2011

S. J. Bentley, M. Holland, X. Li, G.W.Paterson, H. Zhou, O.Ignatova, D. Macintyre, S. Thoms, A. Asenov, B. Shin, J. Ahn, P. C. McIntyre and I.G.Thayne, “Electron mobility in surface- and buried- channel flatband In0.53Ga0.47As MOSFETs with ALD Al2O3 gate dielectric”. IEEE Electron Device Letters, 32 (4). pp. 494-496, 2011

Y. Q. Wu, M. Xu, R.S. Wang, O. Koybasi and P. D. Ye, “High Performance Deep-Submicron Inversion-Mode InGaAs MOSFETs with maximum Gm exceeding 1.1 mS/μm: New HBr Pretreatment and Channel Engineering”, IEDM Tech.Dig. , pp.323-326, Dec., 2009

T.-W. Kim, D.-H. Kim, and J. A. del Alamo, "30 nm In0.7Ga0.3As Inverted-Type HEMTs with Reduced Gate Leakage Current for Logic Applications." IEDM Tech. Dig., pp. 483-485, Dec. 2009.

C.W.Tang, H.Li, Z.Zhong, K.L.NG, K.M.Lau, “Hetero-epitaxy of III-V Compounds lattice-matched to InP by MOCVD for Device Applications”, IEEE International Conference on Indium Phosphide & Related Materials, pp136-139, May, 2009

H. Zhao, Y.-T. Chen, J. Hwan Yum, Y. Wang, N. Goel and J.C. Lee, “High performance In0.7Ga0.3As metal-oxide- IEEE Electron Device Letters, 32 (4). pp. 494-496, 2011 semiconductor transistors with mobility >4400 cm2/V.s using InP barrier layer.” Appl. Phys. Lett. vol. 94, no. 19 pp. 193502, 2009.

T.D.Lin, H.C.Chiu, P.Chang, L.T.Tung, C.P.Chen, M.Hong, J.Kwo, W.Tsai, andY.C.Wang, “High-performance self-aligned inversion-channel In0.53Ga0.47As metal-oxide-semiconductor field-effect-transistor with Al2O3 /Ga2O3(Gd2O3) as gate dielectrics.” Appl.Phys.Lett. 93, 033516 (2008).

H. Zhao, Y.-T. Chen, J. Hwan Yum, Y. Wang, N. Goel, and J. C. Lee, “High performance In0.7Ga0.3As metal–oxide–semiconductor transistors with mobility > 4400 cm2/V ・ s using InP barrier layer,” Appl. Phys. Lett., vol. 94, no. 19, pp. 193 502-1–193 502-3, May 2009.

U. Singisetti, M. A. Wistey, G. J. Burek, A. K. Baraskar, B. J. Thibeault, A. C. Gossard, M. J. W. Rodwell, B. Shin, E. J. Kim, P. C. McIntyre, B. Yu, Y. Yuan, D. Wang, Y. Taur, P. Asbeck, and Y.-J. Lee, “In0.53Ga0.47As channel MOSFETs with self-aligned InAs source/drain formed by MEE regrowth,” IEEE Electron Device Lett., vol. 30, no. 11, pp. 1128–1130, Nov. 2009.

R. Terao, T. Kanazawa, S. Ikeda, Y.Yonai, A. Kato, and Y.Miyamoto,“InP/InGaAs composite metaloxide–semiconductor field-effect transistors with regrown source and Al2O3 gate dielectric exhibiting maximum drain current exceeding 1.3 mA/ μm,” Appl. Phys. Exp., vol. 4, no. 5, pp. 054201-1–054201-3, Apr. 2011.

M. Radosavljevic, B. Chu-Kung, S.Corcoran, G. Dewey, M. K. Hudait, J. M. Fastenau, J. Kavalieros, W. K. Liu, D. Lubyshev, M. Metz, K. Millard, N. Mukherjee, W. Rachmady, U. Shah, and R. Chau, “Advanced high-k gate dielectric for high-performance short-channel In0.7Ga0.3As quantum well field effect transistors on silicon substrate for low power logic applications,” in IEDM Tech. Dig., 2009, pp. 319–321.


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